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(活動新聞及演講檔更新)[研討會/Seminar ] 2023/9/12 超快雷射技術未來趨勢與應用國際研討會/The future trend and application of ultrafast laser technology

20230913更新
【成大新聞】超快雷射國際研討會 促進臺灣與國際雷射技術領先者立陶宛之交流
【演講簡報下載】https://mybox.ncku.edu.tw/navigate/s/99BF55A967774002A64FC9E64F1BD2DCGSY

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超快雷射技術未來趨勢與應用國際研討會/The future trend and application of ultrafast laser technology

◆時間/Time：8:30-15:40

◆地點/Place：成功大學物理系36169教室 / R36169, Department of Physics, NCKU

 

即日起報名至9月5日(二)~  敬邀 各位先進蒞臨指導！

Your participation in this seminar is important for us. If you could attend, please fill  out the form before 5 Sept.  Thank you for your coming.

*報名網址Registration：https://forms.gle/LjQQaSoYvAWTutgy9   QR code

poster

 

*議程Agenda

Tuesday, 12 September 2023

Room 36169, Department of Physic, NCKU / 成大物理系36169教室

08.30 – 09.00

REGISTRATION

報到

09.00 – 09.10

SESSION III

LASER TECHNOLOGY DEVELOPMENTS AND APPLICATIONS

雷射技術趨勢發展與應用

Opening Remarks

開幕致詞

Dr. Hong-Chen Chen, Executive Vice President, NCKU

陳鴻震 副校長，國立成功大學

Dr. Gediminas Raciukaitis, State Research Institute Center for Physical Sciences and Technology (FTMC)

09.10 – 09.30
  • The Developments and Challenges for Future Semiconductor Chips
  • 半導體晶片技術發展趨勢及挑戰

Hann-Huei Tsai, Division Director, Taiwan Semiconductor Research Institute, National Applied Research Laboratories

蔡瀚輝 組長，國研院台灣半導體研究中心

09.30 – 09.50
  • Conductive trace creation for interposers and displays using SSAIL technology
  • 使用 SSAIL 技術使內插器和顯示器創建導電軌跡

Tadas Kildušis, CCO, AKONEER

09.50 – 10.10
  • Glass applications in advanced packaging
  • 先進封裝之玻璃材質應用

Martynas Adomaitis, Technical Project Manager, Workshop of Photonics

10.10 – 10.40
  • COFFEE BREAK

10.40 – 11.00
  • Ultrashort pulsed lasers - from thin to thick glass processing
  • 超快雷射-由薄到厚之玻璃處理

Dr. Paulius Gečys, Head of the Laboratory of Laser Microfabrication Technologies, FTMC

11.00 – 11.20
  • Evolution of surface morphology and roughness control using femtosecond laser pulse
  • 使用飛秒脈衝雷射改進表面形態和粗糙度控制

Dr. Simas Butkus, VU LTC/Light Conversion

11.20 – 11.40
  • Femtosecond laser bursts for efficient material ablation and polishing
  • 飛秒雷射觸發可實現高效的材料燒蝕和拋光

Dr. Andrius Žemaitis, Research Fellow, FTMC

11:40 – 12:00
  • Discussion

12:00 – 13.00

Lunch Time

13.00 – 13.20
  • Laser Technology Focus on Semiconductor Assembly Process
  • 雷射技術應用於半導體封裝製程

Louie Huang, Director, Central Process Engineering, ASE Kaohsiung

黃文彬 處長，日月光 封裝工程處

13.20 – 13.40
  • Tunable GHz and MHz femtosecond burst for advanced material processing
  • 用於先進材料加工的可調諧 GHz 和 MHz 飛秒觸發

Dr. Martynas Barkauskas,CEO, Light Conversion

13.40 – 14.00
  • Flexibility meets precision: advanced femtosecond laser technologies
  • 彈性與精確：先進飛秒雷射技術

Dr. Tadas Bartulevičius, Ekspla

14.00 – 14.30
  • COFFEE BREAK

14.30 – 14.50
  • Unveiling Nanophotonic Metasurfaces: Introducing a Future-Enriching Optical Frontier
  • 揭示奈米光子超穎介面：引入充滿未來前景的光學新領域

Dr. Pin-Chieh Wu, Deputy Director, Meta-nanoPhotonics Center, NCKU

吳品頡 博士，國立成功大學 超穎奈米光子中心 副主任

14.50 – 15.10
  • Why ultrafast lasers are ultrafast at damaging optics
  • 為何超快雷射會超快傷害光學鏡組

Vytautas Jankauskis, Senior sales engineer, OPTOMAN

15:10 – 15:40
  • Discussion

 

*交通指引：

1.如何至成大
2.台南火車站-物理館步行地圖建議
3.如自行開車，請由成大成功校區正門(大學路上)進入校區，於警衛室換證後至理學教學大樓B2地下停車場(約102格)停放。 
(停車場出入口為車牌感應，請於研討會報名時一併提供車號，請利當日進出。)

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